| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release sheet that prevents contamination of a mold on the sheet attachment side upon molding a semiconductor package using the sheet. SOLUTION: The mold release sheet is composed by forming a porous layer on at least one face of a plastic film comprising one or more layers. A fine particle layered film is preferable as the porous layer. The fine particles are preferably non-organic particles with the average primary particle diameter being 1-100 nm. The porous layer preferably has a void volume of 0.02 cc or more per area of 1 m<SP>2</SP>. COPYRIGHT: (C)2010,JPO&INPIT |
