| 摘要 |
PURPOSE: An apparatus and a method for manufacturing a semiconductor package for a wide lead frame are provided to reduce a manufacturing cost and to improve productivity by performing wire bonding with a relatively low cost. CONSTITUTION: An apparatus for manufacturing a semiconductor package for a wide lead frame includes an index rail(120), a loader part, a frame driving part, and a wire bonding part. The index rail transfers a lead frame having a first surface and a second surface into both directions. The loader part is connected to one end part of the index rail, and supplies the lead frame to the index rail. The frame driving part is connected to the other end part of the index rail, and rotates the lead frame. The wire bonding part connects a semiconductor chip attached to the lead frame supplied to the index rail to the lead frame through a wire bond. |
