| 摘要 |
PURPOSE: A semiconductor package and a method of manufacturing the same are provided to prevent the deterioration of electrical property by forming a rewiring through one plating process and controlling the thickness of the rewiring accurately. CONSTITUTION: A semiconductor package is composed of a semiconductor chip(10), a penetrating electrode(30), a rewiring(20), and a dummy conductive pattern(40). The semiconductor chip has a bonding pad electrically connected with bonding pads. T he penetrating electrodes pass through the top and bottom of the semiconductor chip. The rewiring is arranged on the top and a first end is combined with each penetration electrode as one body. A second end is connected with each bonding pad corresponding to each penetration electrode electrically.
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