发明名称 HEAT PIPE, A DISTRIBUTION SUPPLY STRUCTURE USED AS HEAT TRANSFER MEDIUM AND AN UNDERFLOOR HEATING DEVICE
摘要 A distribution supply structure used as a heat transfer medium according to the invention comprises: a plurality of heat conductors which are arranged transversely underneath the indoor floor and can be filled with heat transfer media; and a distribution pipe which is connected by the medium of connection means to an end of the thermal conductor in such a way as to be able to communicate therewith and has a through hole formed inside to be filled with the heat transfer medium and a heat generator positioned close to the through hole and filled with a heat medium.  Accordingly, the invention has useful effects on the improvement of heat transfer efficiency as it quickly distributes and supplies a heat transfer medium into a plurality of heat conductors using one pipe being laid, and demonstrates a high heat diffusion rate of the heat medium which is a fluid filled inside the heat generator, with the heat generator being disposed inside the distribution pipe.
申请公布号 WO2009131412(A2) 申请公布日期 2009.10.29
申请号 WO2009KR02159 申请日期 2009.04.24
申请人 CHOI, YOUNGKIL 发明人 CHOI, YOUNGKIL
分类号 F28D15/02 主分类号 F28D15/02
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