POLYORGANOSILOXANE COMPOUND, RESIN COMPOSITION COMPRISING THE SAME, AND PATTERN FORMING METHOD THEREOF

摘要

PURPOSE: A polyorganosiloxane compound is provided to obtain good film characteristics and high reliability as a protective coating so that they are widely applicable for the protection of various circuit boards. CONSTITUTION: A polyorganosiloxane compound has the average compositional formula (1): R1aSi(OR2)b(OH)cO(4-a-b-c)/2 which is modified such that some hydrogen atoms of silicon-bonded hydroxyl groups are substituted by acid labile groups of the general formula (2) and/or are crosslinked within the molecule or between molecules with a crosslinking group having a C-O-C linkage represented by the general formula (3), the polyorganosiloxane compound having a weight average molecular weight of 300 to 200,000 as measured by GPC versus polystyrene standards.