发明名称 SOLDER BALL TEMPLATE AND MANUFACTURING METHOD FOR THE SAME
摘要 PURPOSE: A solder ball template and a manufacturing method thereof are provided to decrease the necessary expenses by forming the solder ball template with the respectively dissimilar material. CONSTITUTION: A penetration hole(14a) in which the solder ball is settled by the etching process is formed in a core template(14). A base template(12) is fixed and adhered to the core template. The core template is produced in 1μm~3mm thickness with the material selected from the glass substrate, the silicon substrate, and the ceramics. The base template is produced in the number of mm thickness with the material selected from the metal, the non-metal, the ceramics, and the synthetic resin.
申请公布号 KR20090112963(A) 申请公布日期 2009.10.29
申请号 KR20080038770 申请日期 2008.04.25
申请人 ADP ENGINEERING CO., LTD. 发明人 PARK, SANG IL
分类号 H05K3/40;H01L21/60;H01L23/48;H05K3/34 主分类号 H05K3/40
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