METHOD OF MAKING DEMOUNTABLE INTERCONNECT STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for recovering an electronic device from a base insulating layer without damaging both the electronic device and the base insulating layer.

SOLUTION: A method for making an interconnect structure includes the steps of: applying a first metal layer 24 to an electronic device 18, wherein the electronic device 18 comprises at least one I/O contact 23 and the first metal layer 24 is located on a surface of the I/O contact 23; and applying a removable layer 26 to the electronic device 18. The removable layer 26 is adjacent to the first metal layer 26. An adhesive layer 16 is applied to the electronic device 18 or to a base insulative layer 10. The electronic device 18 is secured to the base insulative layer 10 using the adhesive layer 16. The first metal layer 24 and removable layer 26 are disposed between the electronic device 18 and the base insulative layer 10.

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