| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin sealed light emitting diode which can manufacture a surface mounted LED with sufficient productivity by adding mold release of a specific density to sealing resin. <P>SOLUTION: In a method of manufacturing a transparent resin sealed light emitting diode which forms a transparent sealing resin composition on a lead frame mounting a light emitting diode (LED) chip to cover the LED chip and forms a resin sealing portion by hardening the transparent sealing resin composition, an injection molding machine performs injection molding of the sealing resin composition containing 0.05-5 parts by mass of mold release for 100 parts by mass of sealing resin to cover the LED chip and hardens the sealing resin composition thus forming a resin sealing portion. Good mold releasability is obtained for a metal mold in injection molding by adding mold release of a specific density to sealing resin, and a resin sealed light emitting diode can be produced by continuous injection molding. <P>COPYRIGHT: (C)2010,JPO&INPIT |
