| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component built-in wiring board which is manufactured inexpensively while soundness as a wiring board is maintained, and to provide a method of manufacturing the same. <P>SOLUTION: The component built-in wiring board includes: a semiconductor element 41 having a first insulating layer 11, second insulating layers 12, 13, 14, and 15 disposed in a stack on the first insulating layer, a semiconductor chip buried in the second insulating layers and having a terminal pad, and surface mounting terminals in a grid array electrically connected to the terminal pad; a wiring pattern provided while sandwiched between the first insulating layer and second insulating layers and including a mounting land for the semiconductor element; a connection member electrically and mechanically connecting the surface mounting terminals of the semiconductor element to the mounting land; and a resin provided between the semiconductor element and first insulating layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
