| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring substrate capable of forming a wiring pattern with high accuracy on an aluminum nitride sintered body with high joint strength. Ž<P>SOLUTION: The manufacturing method of the wiring substrate comprises the processes of: performing calcination by applying high-melting metal paste on an aluminum nitride sintered body substrate to form the wiring pattern consisting of high-melting metal; and applying copper paste constituted by providing copper particles on the wiring pattern consisting of the high-melting metal, performing the calcination below a melting point of copper, and printing the copper paste to form a copper wiring pattern, wherein the copper paste contains 30-65 mass% of copper particles and/or copper oxide particles with average particle diameter of 100-800 nm by taking mass of the whole copper particles as 100 mass%. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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