发明名称 CONDUCTIVE PASTE AND MOUNTING STRUCTURE USING THE SAME
摘要 A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.
申请公布号 US2009269598(A1) 申请公布日期 2009.10.29
申请号 US20090427275 申请日期 2009.04.21
申请人 OHASHI NAOMICHI;MIYAKAWA HIDENORI;YAMAGUCHI ATSUSHI;KISHI ARATA;HIGUCHI TAKAYUKI 发明人 OHASHI NAOMICHI;MIYAKAWA HIDENORI;YAMAGUCHI ATSUSHI;KISHI ARATA;HIGUCHI TAKAYUKI
分类号 H01B1/22;B32B15/08 主分类号 H01B1/22
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