Epoxy composition, adhesive film, dicing die bonding film and semiconductor device

摘要

PURPOSE: An epoxy-based composition is provided to minimize the incidence of burrs during processing while at the same time exhibiting outstanding high-temperature adhesive properties and displaying superior resilience characteristics. CONSTITUTION: An epoxy-based composition has a gel content of from 5% to 20% when measured under specific conditions. The gel content is measured after drying the epoxy-based composition at 110 deg.C for 3 minutes. The epoxy-based composition comprises a thermosetting resin, an epoxy resin, and a curing agent. An adhesive film includes a base film(10) and an adhesive layer(20).