| 摘要 |
PURPOSE: A method of manufacturing a semiconductor package and the semiconductor package using the same are provided to improve the productivity by forming a bump and a wiring at the same time. CONSTITUTION: A method of manufacturing a semiconductor package and the semiconductor package using the same are comprised of the steps: adhering bonding pads of a semiconductor chip(20) so that the bonding pads are faced with the top of the substrate; forming a penetration hole(16) exposing each bonding pads on a substrate(10); filling the penetration hole and forming a metal film covering the bottom on the bottom facing the top; and patterning the metal film and forming a circuit pattern including a bump and a wiring on the bottom facing with the top.
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