发明名称 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR FORMING FINE PITCH THEREOF
摘要 PURPOSE: A flexible printed circuit board and a fine pitch formation method thereof are provided to improve the insulating property between wirings by forming an undercut at the lower end of the wirings. CONSTITUTION: A region in which a wiring(140) is formed among a base substrate(10) is etched. A conductive layer(90) is formed on the etched region. A photoresist film is formed on a substrate between the etched regions. The third photoresist film is formed on the front side of the flexible printed circuit board(165) to form a capping layer(160). The wirings are formed by forming the conductive layer on the etched regions higher than the substrate.
申请公布号 KR20090113074(A) 申请公布日期 2009.10.29
申请号 KR20080038952 申请日期 2008.04.25
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 PARK, CHONG HAN;KIM, BYOUNG WOO
分类号 H05K3/06 主分类号 H05K3/06
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