发明名称 |
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR FORMING FINE PITCH THEREOF |
摘要 |
PURPOSE: A flexible printed circuit board and a fine pitch formation method thereof are provided to improve the insulating property between wirings by forming an undercut at the lower end of the wirings. CONSTITUTION: A region in which a wiring(140) is formed among a base substrate(10) is etched. A conductive layer(90) is formed on the etched region. A photoresist film is formed on a substrate between the etched regions. The third photoresist film is formed on the front side of the flexible printed circuit board(165) to form a capping layer(160). The wirings are formed by forming the conductive layer on the etched regions higher than the substrate.
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申请公布号 |
KR20090113074(A) |
申请公布日期 |
2009.10.29 |
申请号 |
KR20080038952 |
申请日期 |
2008.04.25 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
PARK, CHONG HAN;KIM, BYOUNG WOO |
分类号 |
H05K3/06 |
主分类号 |
H05K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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