POWER SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a power semiconductor device that neither increases in cost and man-hour nor decreases in assembly easiness while accurately and rapidly detecting a switching element generating heat.

SOLUTION: A heat dissipation plate 14 mounted opposite to a first frame portion 2a where power semiconductor elements 4 and 5 are mounted is extended to a reverse surface part of a second frame portion 2c where an integrated circuit 6 for control is mounted to have an extension part 15 which is thicker than a part of the heat dissipation plate 14 which faces the first frame portion 2a and close to the second frame portion 2c.

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