| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device of superior electric connectivity and high reliability even when a semiconductor chip is flip-chip-bonded to a rigid substrate like a glass. <P>SOLUTION: A plurality of metal bumps 2 formed on an electronic element 1 are electrically connected to a plurality of electrode pads 3 formed on a substrate 6 for mounting circuit via an adhesive agent layer 5, in the electronic device. A flexible layer 5 is formed between the substrate and each electrode pad, and the flexible layer has an island shape parted for each one or several electrode pads. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
