| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer resistivity measuring apparatus which rectify correctly a measured value variation depending on a measuring position in the vicinity of an wafer end, and can find an exact value. <P>SOLUTION: In the semiconductor wafer resistivity measuring apparatus to measure the resistivity of a semiconductor wafer 12 using a four-probe resistivity measuring apparatus, when measuring the resistivity of an end of the semiconductor wafer 12, a correction value corresponding to each error is obtained by multiplying the correction factor of each different error, and at the same time, the standard deviation of relevant correction value is obtained, and then the error in which the standard deviation becomes minimum is determined as an actual error in regard to the measured value of the position P<SB>n</SB>, P<SB>n+5</SB>, P<SB>n+15</SB>on a straight line in a radial direction from the wafer end 12a, taking into consideration an error caused by a difference between the distance R from each measuring position to the wafer end 12a and the distance R' to the end 31a of a thin film 31 formed on the semiconductor wafer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
