| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating method for suppressing deposition of gold between wiring patterns without changing nickel plating liquid in a short period of time. SOLUTION: The plating apparatus 10 comprises a metallic plating tank 1 for storing the plating liquid 7, electrodes 2 to be immersed in the plating liquid 7, and a power supply unit 6. The lead wire 4 of a reference electrode and the lead wire 5 of a counter electrode which are connected to the power supply unit 6 respectively are connected to the plating tank 1, and the plating tank 1 is made an anode. The lead wire 3 of a sample electrode connected to the power supply unit 6 is connected to the electrode 2, and the electrode 2 is made a cathode. The potential difference between the plating tank 1 and the electrodes 2 is set to the natural polarization potential by the power supply unit 6. COPYRIGHT: (C)2010,JPO&INPIT
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