| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable a wafer to be fixed, and to detect whether or not a wafer cracks. Ž<P>SOLUTION: A substrate processing apparatus includes a substrate conveying device having a substrate mounting tool for holding the substrate. The substrate conveying device includes a gripper 6 which is provided so as to cope with the substrate mounting tool, includes at least a columnar or cylindrical chip portion for gripping or releasing the substrate with the substrate mounting tool by moving forward to and backward away from the substrate mounted on the substrate mounting tool, and is formed symmetrically about the axis of the columnar or cylindrical shape, a driving device provided to a base end portion of the substrate mounting tool and makes the gripper move forward and backward, and a detector which is provided to the driving device and detects the operation state of the gripper so as to detect the state of the substrate on the substrate mounting tool. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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