发明名称 PATTERN INSPECTION APPARATUS, PATTERN INSPECTION METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To enable high-precision and high-speed pattern inspection by a small processing capacity. Ž<P>SOLUTION: The pattern inspection apparatus computes a statistics value showing a degree of a gap in matching an image of an inspection object pattern and CAD data corresponding to the inspection object pattern, determines the necessity of correction processing based on the statistics value, performs correction processing onto a polygon figure in the CAD data when it is determined that correction processing is required, and compares the polygon figure been corrected with the pattern image. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009252959(A) 申请公布日期 2009.10.29
申请号 JP20080098320 申请日期 2008.04.04
申请人 TOSHIBA CORP 发明人 NAGANO OSAMU
分类号 H01L21/66;G06T1/00 主分类号 H01L21/66
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