| 摘要 |
In an electronic component mounting apparatus including an electronic component mounting head for holding an electronic component and an up/down device for pressing the electronic component against a circuit board, the electronic component is pressed against the circuit board while ultrasonic vibrations are applied from an ultrasonic transducer of the electronic component mounting head to the electronic component via a component holding unit, so that the electronic component is mounted onto the circuit board. In the electronic component mounting apparatus, the electronic component is heated via the component holding unit by radiant heat from a heater fixed to the component holding unit in a noncontact state, so that even under the condition that the electrothermal heater is replaceably attached, characteristics of the ultrasonic vibrations applied to the electronic component can be maintained constant.
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