| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which is excellent in fluidity and solder reflow resistance, and to provide an electronic parts device equipped with an element sealed with the molding material. SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent and (C) a silane compound of general formula (I), wherein R<SP>1</SP>-R<SP>6</SP>represent a hydrogen atom or a (substituted) 1C-12C linear alkyl group, branched alkyl group, cycloalkyl group or aryl group; R<SP>7</SP>and R<SP>8</SP>are the same or different and represent a substituted or unsubstituted 1C-12C linear alkyl group, branched alkyl group, cycloalkyl group or aryl group; R<SP>9</SP>represents a 1C-10C divalent (substituted) hydrocarbon group; and p represents an integer of 1-3. COPYRIGHT: (C)2010,JPO&INPIT |
