| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure of a spacer which prevents a heat damage to a main body part of an electronic component even when temperature of soldering is made into high temperature. Ž<P>SOLUTION: The spacer 11 in a first embodiment is constituted of a non-conduction part 12 and a conduction part 13. The conduction part 13 is constituted of a pair of semicylindrical shape parts 13a, 13b formed of metal with successful thermal conductivity, and has holes 14a, 14b with and into which a lead 2 of the electronic component 1 contacts and is inserted. The non-conduction part 12 is formed in the cylindrical shape by a thermally and electrically non-conductive material. The semicylindrical shape parts 13a, 13b of the conduction part 13 are inserted in internal holes 15, respectively. Height of the non-conduction part 12 is higher than that of the conduction part 13. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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