WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A wiring board (10) is provided with a through hole (11b), which penetrates the wiring board (10), in a semiconductor chip mounting region (15), and a groove-like pattern (12), which is connected to the through hole (11b) on a solder resist (9) in the semiconductor chip mounting region (15). Water which stays in the semiconductor chip mounting region (15) is guided to the through hole (11b) by the groove-like pattern (12) and efficiently discharged from the semiconductor chip mounting region (15). Thus, vaporization and expansion are not generated inside a semiconductor device (30) due to heat, which is applied when the semiconductor device (30) using the wiring board (10) is being manufactured and when mounting on a mounting board is being performed, and expansion of the semiconductor device is reduced.