<p>A probe apparatus comprises a wiring board which has a plurality of terminals; a wafer tray which is provided so as to form a closed space with the wiring board and on which a semiconductor wafer is placed; a probe wafer which is provided between the wiring board and the wafer tray, with apparatus-side connection terminals connected electrically with the terminals of the wiring board and wafer-side connection terminals connected electrically together with respective semiconductor chips; an apparatus-side anisotropic conductive sheet provided between the wiring board and the probe wafer; a wafer-side anisotropic conductive sheet provided between the probe wafer and the semiconductor wafer; and a depressurization part which depressurizes the closed space between the wiring board and the wafer tray to make the wafer tray approach the wiring board to a predetermined position to electrically connect the wiring board with the probe wafer and to electrically connect the probe wafer with the semiconductor wafer.</p>
