发明名称 TEMPERATURE CONTROL DEVICE OF ELECTRONIC COMPONENT, AND HANDLER DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a temperature control device of an electronic component for controlling the temperature of the electronic component with superior responsiveness, and to provide a handler device having the temperature control device of the electronic component. <P>SOLUTION: This temperature control device 10 of the electronic component performs control so that the electronic component 40 to be inspected keeps a predetermined temperature during inspection, and has a circulation circuit formed of pipes 17 and 18, where a refrigerant flows, and a compressor 1, condenser 2, expansion apparatus 6, and evaporator 7 disposed in its midway. The evaporator 7 cools the electronic component 40 by evaporating the refrigerant. The evaporator 7 comprises a housing 72, and a heat-dissipating member 71, that is stored in it and performs heat exchange between it and the refrigerant, and the heat dissipation member 71 is made of a foam metal material. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009250810(A) 申请公布日期 2009.10.29
申请号 JP20080099735 申请日期 2008.04.07
申请人 SEIKO EPSON CORP 发明人 NAKAMURA SATOSHI;OTSUKA ISAMU;HOSOMI HIROAKI
分类号 G01R31/26;F28D15/02 主分类号 G01R31/26
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