发明名称 ELECTRONIC COMPONENT BUILT-IN WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To improve the effect of removing high-frequency noise flowing between anode connection terminals while meeting the need of larger capacity of a capacitor, and to make a board thin. <P>SOLUTION: A connection terminal portion comprises: anode connection terminal portions electrically connected to a valve metal sheet body of a solid-state electrolytic capacitor at least at two or more places through a wiring pattern and inductors and/or a via electrode and/or a through electrode; a cathode connection terminal portion electrically connected to a current collector layer of the solid-state electrolytic capacitor through the wiring pattern and/or inductors and/or via electrode and/or through electrode, the inductor being formed in a conductor pattern shape. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009252763(A) 申请公布日期 2009.10.29
申请号 JP20080094665 申请日期 2008.04.01
申请人 PANASONIC CORP 发明人 FUJII TATSUO;ISHITOMI HIROYUKI;SUGAYA YASUHIRO;HASHIGUCHI KATSUNORI
分类号 H05K3/46;H01G2/06;H01G4/40;H01G9/012 主分类号 H05K3/46
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