| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that although a multilayer ceramic electronic component buried in a component built-in printed wiring board is desired to be wide in bonding area of an external electrode on a principal surface, an external electrode formed by immersion coating is thick on the principal surface side thereof because of viscosity of conductive paste; and the multilayer ceramic electronic component needs to be made thin in thickness on the whole, or it cannot be made multilayered. <P>SOLUTION: Extension parts 9a and 9b are formed by printing on a principal surface 7 of a function part 4 and lead-out parts 5a and 5b, and routing parts 10a and 10b are formed by immersion coating from end surfaces 6a and 6b to a surface of the extension parts 9a and 9b of the lead-out parts 5a and 5b to provide external electrodes 8a and 8b. At this time, the lead-out parts 5a and 5b are made thinner than the function part 4, and the surface of the extension parts 9a and 9b on the principal surface 7 of the lead-out parts 5a and 5b is formed thinner than the surface of the extension parts 9a and 9b on the principal surface 7 of the function part 4 to absorb the thickness on the side of the principal surface 7 of the routing parts 10a and 10b, so that the function part 4 is provided with large thickness. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
