| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for processing a semiconductor wafer capable of avoiding the entrainment of air bubbles between an adhesive sheet and a wafer and performing the adjustment of various processing devices such as a sheet attaching device and a grinding device by knowing the attachment state of the adhesive sheet after attaching the adhesive sheet to the wafer, to provide a method of adjusting the semiconductor wafer processing device using the same, and to provide a method of evaluating the adhesive sheet. SOLUTION: One surface of a base material sheet BS is provided with an adhesive layer A to form an adhesive sheet S for processing a semiconductor wafer. In the adhesive sheet, through-holes H are provided at a predetermined distance. When attaching the adhesive sheet to the wafer, air between them comes off from the through-holes. Moreover, after attaching the adhesive sheet to the wafer, the stretch, slackness, etc. of the adhesive sheet are known by measuring the length of the distance between the through-holes. On the basis of the result, the adjustment of the wafer processing device of the adhesive sheet attaching device 11 or the like is performed, and the characteristics of the adhesive sheet can be evaluated. COPYRIGHT: (C)2010,JPO&INPIT |
