| 摘要 |
PROBLEM TO BE SOLVED: To prevent a thermosensitive adhesive sheet from peeling off an adherend or getting rolled up after being stuck. SOLUTION: The sheet sticking device 10 is configured to stick the thermosensitive adhesive sheet S which does not have adhesive strength at room temperature on a semiconductor wafer W. The sheet sticking device 10 includes a table 11: a press roller 12 which sticks the adhesive sheet S which is large enough to project from an outer circumference of an adherend surface W1 of the semiconductor wafer W; a cutting means 13 which cuts the adhesive sheet S in accordance with the size of the adherend surface W1; and a collecting means 14 which collects an unnecessary adhesive sheet S1 produced outside the respective adherend surface W1 as a result of the cutting by the cutting means 13. The table 11 includes an internal table 17 supporting the semiconductor wafer W and an external table 16 supporting the unnecessary adhesive sheet S1. The external table 16 includes a temporary sticking allowing means 22 of holding the adhesive sheet S on a placing surface 16A thereof in contact. COPYRIGHT: (C)2010,JPO&INPIT |
