发明名称 METAL-CERAMICS BONDING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND METAL-CERAMICS BONDING BODY
摘要 PROBLEM TO BE SOLVED: To provide a metal-ceramics bonding substrate and a manufacturing method therefor, which can manufacture without deteriorating the mechanical property and the insulation withstanding voltage of the metal-ceramics bonding substrate, and economically, in the multi-piece manufacturing method of the metal-ceramics bonding substrate. SOLUTION: The method for manufacturing the metal-ceramics bonding substrate includes: a step for forming a scribe line in the surface of a ceramics substrate by a scriber; a step for forming a metal-ceramics bonding body by bonding a metal plate to the surface of the ceramics substrate; a step for forming a pattern by treating the metal plate so as to expose the scribe line; and a step for obtaining the metal-ceramics bonding substrate by dividing the metal-ceramics bonding body along the scribe line. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009252971(A) 申请公布日期 2009.10.29
申请号 JP20080098536 申请日期 2008.04.04
申请人 DOWA METALTECH KK 发明人 OSANAI HIDEYO
分类号 H05K3/00;B28D1/24;B28D5/00 主分类号 H05K3/00
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