发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE |
摘要 |
The invention provides a photosensitive resin composition comprising: a polymer comprising a polymerizable group and a functional group that interacts with a plating catalyst or a precursor thereof so as to form a coordination bond; and at least one selected from the group consisting of a synthetic rubber, an epoxy acrylate monomer, and a polymerizable monomer having a benzyl alcohol group; a laminate; a method of producing a metal plated material; a metal plated material; a method of producing a metal pattern material; a metal pattern material; and a wiring substrate.
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申请公布号 |
US2009266583(A1) |
申请公布日期 |
2009.10.29 |
申请号 |
US20090426964 |
申请日期 |
2009.04.21 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
NAGASAKI HIDEO;KANO TAKEYOSHI |
分类号 |
H05K1/00;B05D3/10;B32B3/10;B32B15/08;C08F12/24;C08F22/30;C08F124/00;H01B13/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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