发明名称 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL AND WIRING SUBSTRATE
摘要 The invention provides a photosensitive resin composition comprising: a polymer comprising a polymerizable group and a functional group that interacts with a plating catalyst or a precursor thereof so as to form a coordination bond; and at least one selected from the group consisting of a synthetic rubber, an epoxy acrylate monomer, and a polymerizable monomer having a benzyl alcohol group; a laminate; a method of producing a metal plated material; a metal plated material; a method of producing a metal pattern material; a metal pattern material; and a wiring substrate.
申请公布号 US2009266583(A1) 申请公布日期 2009.10.29
申请号 US20090426964 申请日期 2009.04.21
申请人 FUJIFILM CORPORATION 发明人 NAGASAKI HIDEO;KANO TAKEYOSHI
分类号 H05K1/00;B05D3/10;B32B3/10;B32B15/08;C08F12/24;C08F22/30;C08F124/00;H01B13/00 主分类号 H05K1/00
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