ADHESION AND ELECTROMIGRATION IMPROVEMENT BETWEEN DIELECTRIC AND CONDUCTIVE LAYERS
摘要
<p>A method and apparatus for processing a substrate is provided. The method of processing a substrate includes providing a substrate comprising a conductive material, performing a pre-treatment process on the conductive material, flowing a silicon based compound on the conductive material to form a silicide layer, performing a post treatment process on the silicide layer, and depositing a barrier dielectric layer on the substrate.</p>
申请公布号
WO2009131825(A2)
申请公布日期
2009.10.29
申请号
WO2009US39653
申请日期
2009.04.06
申请人
APPLIED MATERIALS, INC.;LEE, SANG, M.;LEE, YONG-WON;SHEK, MEIYEE;XIA, LI-QUN;WITTY, DEREK, R.
发明人
LEE, SANG, M.;LEE, YONG-WON;SHEK, MEIYEE;XIA, LI-QUN;WITTY, DEREK, R.