| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition for the printed wiring board capable of forming a curing film that sufficiently meets performance required as a permanent mask resist, and keeping a sufficiently high filtering speed even if filter paper with small pores is used. SOLUTION: The curable resin composition for a printed wiring board comprises a curable resin (A), barium sulfate fine particles (B) whose surfaces are coated with aluminum compounds and organic silicon compounds, and a curing agent (C). COPYRIGHT: (C)2010,JPO&INPIT
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