| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an original plate of a ceramic printed circuit board which has superior heat dissipation characteristics and electric characteristics by forming an adhesion layer and a thick electric conductive layer of high density on a ceramic board by a sputtering method for physical vapor deposition, and to provide a method of manufacturing the original plate. <P>SOLUTION: The method of manufacturing the original plate includes a step of forming the adhesion layer on the ceramic board by the sputtering method for physical vapor deposition, a step of vapor-depositing a first thin film made of a conductive metal and having compressive residual stress on the adhesion layer by the sputtering method, a step of vapor-depositing a second thin film made of a conductive metal and having tensile residual stress on the first thin film by the sputtering method, and a step of repeating the steps of vapor-depositing the first thin film and second thin film to vapor-deposit the electric conductive layer of a thick film such that the total residual stress is controlled within a preset range. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
