| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent breakage of a semiconductor chip 10 by preventing stress generated in pressing a support electrode body 30 in a heat radiation plate 40, tensile stress on a sealing resin 70 and a lead electrode body 50, and separation/coming-off of the sealing resin 70 from the support electrode body 30 due to repeated use in a high-temperature region. <P>SOLUTION: The shape of an outer peripheral sidewall 34 of a base 31 on the support electrode body 30 is continuously tilted in the center direction toward the bottom part of a groove 32. By setting the height of the tilted part to 60-90% of the height of the base 31, sufficient holding force by hooking action between the sealing resin 70 and itself is exerted, workability of the support electrode body 30 is improved, and strength as a product is improved. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
