| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that in a thin film probe comprising a polyimide multilayer wiring sheet having probes on its undersurface, pressing pieces made of 42 alloy provided on its upper side, and an elastomer sheet and a lower polyimide back sheet provided therebetween, a pressing structure consisting of the pressing pieces, the elastomer sheet, and the polyimide back sheet has the same two-dimensional size and covers an area slightly outside an area under test, thereby preventing the probe needles arranged corresponding to the peripheral part of the area under test from being influenced by the end part of the pressing structure, wherein even such a structure causes ununiformity in prove pressure during actual measurement. Ž<P>SOLUTION: The method for manufacturing a semiconductor integrated circuit device performs a test using the thin film probe in which space is provided on part of the undersurface of the back sheet which does not correspond to the position of the probe needles. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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