发明名称 Assembly Method for Implantable Medical Device
摘要 An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.
申请公布号 US2009266573(A1) 申请公布日期 2009.10.29
申请号 US20080109838 申请日期 2008.04.25
申请人 MEDTRONIC, INC. 发明人 ENGMARK DAVID B.;GROSE GARY M.;SCHAEFER TODD H.;CEBALLOS THOMAS I.;RIES ANDREW J.
分类号 H05K3/36;H05K5/06 主分类号 H05K3/36
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