CHIP STACK METHOD FOR STACK CHIP PACKAGE

摘要

PURPOSE: A chip stack method for stacking chip package is provided to reduce cost and time by simply stacking the semiconductor chips. CONSTITUTION: A chip stack method for stacking chip package comprises a five steps. A first step includes a preparation of a plurality of semiconductor chips having a bonding pad. A second step is to form a first stud bump(12) in the bonding pad of a first semiconductor chip(10) which is arranged in the lowest location. A third step is to form a penetration hole in the bonding pad of the second semiconductor chip(14) to be stacked on the first semiconductor chip. A fourth step is to stack the second semiconductor chip on the first semiconductor chip by inserting the first stud bump formed in the first semiconductor chip in the penetration hole of the second semiconductor chip. A fifth step is to form the second stud bump(16) on the first stud bump inserted in the penetration hole of the second semiconductor chip into a single body.