| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing epoxy resin composition having good adhesion to noble metals such as Ag and Au, good reflow resistance, and flame retardancy improved without detriment to reliability such as moldability, moisture resistance, and high-temperature standing characteristics and to provide an electronic parts device equipped with elements sealed therewith. SOLUTION: Disclosed is a sealing epoxy resin composition containing (A) an epoxy resin represented by formula (I), (B) a curing agent, and (C) a compound represented by formula (II) (wherein R<SP>1</SP>to R<SP>4</SP>, and R<SP>9</SP>are each selected from among a hydrogen atom, a 1-6C alkyl group, and a 1-2C alkoxyl group and may be the same or different from each other). COPYRIGHT: (C)2010,JPO&INPIT
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