发明名称 |
ANISOTROPIC CONDUCTIVE FILM EXCELLENT IN CONNECTION RELIABILITY, AND CIRCUIT CONNECTING STRUCTURE USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive film applied with the optimal value of a parameter which effects on the connection reliability. Ž<P>SOLUTION: A flexural elastic modulus ratio [M<SB>2</SB>/M<SB>1</SB>] which is a proportion of the flexural elastic modulus value M<SB>2</SB>after curing reaction completion and the flexural elastic modulus value M<SB>1</SB>before curing is 10 or more, and a curing behavior index value τ=t<SB>a</SB>/t<SB>total</SB>(t<SB>a</SB>: time for curing rate to reach 50%, t<SB>total</SB>: total curing time) is between 0.2 and 0.5 or between 0.3 and 0.75. An acrylate anisotropic conductive film has the optimized curing behavior and flexural elastic modulus ratio [M<SB>2</SB>/M<SB>1</SB>]. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2009252748(A) |
申请公布日期 |
2009.10.29 |
申请号 |
JP20090093630 |
申请日期 |
2009.04.08 |
申请人 |
LS MTRON LTD |
发明人 |
WOO SANG WOOK;HAN YONG SEOK;PARK JEONG BEOM;CHO IL RAE;KIM JUNG SUN;ROH JUNE;SHIN DONG HUN;LEE KYON-JUN |
分类号 |
H01R11/01;C09J4/02;C09J7/00;C09J9/02;C09J11/00;H01B1/22;H01L21/60 |
主分类号 |
H01R11/01 |
代理机构 |
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地址 |
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