摘要 |
A heat-radiating microcomputer case includes a base having a bottom wall and two upright side walls, a top cover having a plurality of radiating fins formed on a top surface thereof, and a system unit located below a bottom surface of the top cover. Each of the two upright side walls of the base has a free edge with an insertion channel formed along an outer corner thereof. The top cover has two downward extended insertion sections slidably fitted in the insertion channels on the base to detachably assemble to the base. The system unit includes a circuit board having a heat-producing electronic element arranged on an upper side thereof to contact with the bottom surface of the top cover, so that heat produced by the electronic element may be transferred to the large-area top cover and dissipated into ambient air quickly.
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