APPARATUS AND METHOD FOR FORMING SOLDER BUMP

摘要

PURPOSE: An apparatus and a method for forming solder bump are provided to perform a manufacturing process and to reduce manufacturing expenses of printed circuit board by forming solder bump on the board through a reflow process. CONSTITUTION: A method of building solder bump is as follows. A current circuit(11) is patterned on a template(10) and the template is electroplating with a solder. The solder bump is formed on the template by printing the melted solders on the board. The step to form the solder bump on top of the board is as follows. A template and board are arranged. The template is heated to melt the solders and printed on the board.