METHOD OF MANUFACTURING CORELESS PRINTED CIRCUIT BOARD WITH STIFFNESS

摘要

PURPOSE: A method for manufacturing a coreless printed circuit board is provided to obtain sufficient stiffness on a substrate by selectively removing a carrier according to a pattern shape. CONSTITUTION: An insulation layer and a copper layer are stacked on one surface of a carrier(102) used as a core. A pad mounting a copper circuit and a chip is formed according to a circuit pattern by photographing/etching/plating. A dry film is coated on the surface of a carrier. A dry film pattern mask is formed by selectively etching the dry film to expose the pad to mount a semiconductor chip. The exposed carrier is peeled off using the dry film with the pattern as a mask.