发明名称 |
Copper alloy-based slide material, and copper alloy-based slide member |
摘要 |
<p>Disclosed is a copper alloy-based slide material which does not contain lead and has improved anti-seizing property and improved surface pressure resistance. Also disclosed is a copper alloy-based slide member. The copper alloy-based slide material comprises: a Cu-containing parent phase (23) which contains 5 to 15 wt% of Sn; and an alloy steel particle (25) which contains a fine carbide (24) and is dispersed in the parent phase (23) at a ratio of 1 to 20 wt% relative to the total weight of the slide material. The slide material has a Vickers hardness (Hv) ranging from 44 to 148 as a macro-hardness.</p> |
申请公布号 |
GB2459427(A) |
申请公布日期 |
2009.10.28 |
申请号 |
GB20090015896 |
申请日期 |
2008.04.24 |
申请人 |
KOMATSU LTD |
发明人 |
MASANORI UEYAMA |
分类号 |
C22C1/05;B22F7/00;B22F7/04;C22C1/10;C22C9/02;C22C32/00;F16C33/10;F16C33/12 |
主分类号 |
C22C1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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