发明名称 LIGHT EMITTING DEVICE, PACKAGE, LIGHT EMITTING DEVICE MANUFACTURING METHOD, PACKAGE MANUFACTURING METHOD AND PACKAGE MANUFACTURING DIE
摘要 <p>Provided is a light emitting device wherein a resin molded body having a circular or an oval recessed section at the center suppresses generation of cracks. A light emitting device (1) is provided with a light emitting element (2); a first resin molded body (10) having a plurality of outer surfaces (11), and a recessed section (10a) at the center; a first lead (20) and a second lead (30) electrically connected to the light emitting element (2); and a second resin molded body (40) applied in the recessed section (10a). The light emitting element (2) is place on the first lead (20), and the surface of the second resin molded resin (40) is permitted to be a light emitting surface. A gate notch (50) obtained by cutting a gate formed on the outer surface (11) of the first resin molded body (10) is formed on an extended line of a normal line on one point on a circular cross-section of the recessed section (10a) in the normal nine direction.</p>
申请公布号 EP2112697(A1) 申请公布日期 2009.10.28
申请号 EP20070850551 申请日期 2007.12.13
申请人 NICHIA CORPORATION 发明人 HAYASHI, MASAKI
分类号 H01L33/52 主分类号 H01L33/52
代理机构 代理人
主权项
地址