发明名称 |
MEMBER FOR ELECTRONIC CIRCUIT, METHOD FOR MANUFACTURING THE MEMBER, AND ELECTRONIC PART |
摘要 |
A member (12A) for use in an electronic circuit has a thermally conductive layer (22) mounted on a heat sink (20). The thermally conductive layer (22) comprises an insulating substrate (24), a first joint member (26) joining the insulating substrate (24) to the heat sink (20) and containing an active element, a second joint member (28) disposed on the insulating substrate (24), and an electrode (30) disposed on the second joint member (28). The insulating substrate (24) comprises an AlN layer or an Si3N4 layer. Each of the first and second joint members (26, 28) is made of a hard brazing material containing an active element. The heat sink (20) is made of an SiC/Cu composite material or a C/Cu composite material. <IMAGE> |
申请公布号 |
EP1363325(A4) |
申请公布日期 |
2009.10.28 |
申请号 |
EP20010273782 |
申请日期 |
2001.12.19 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
ISHIKAWA, SHUHEI;ISHIKAWA, TAKAHIRO;KIDA, MASAHIRO;SUZUKI, KEN |
分类号 |
H01L23/373;H05K1/03;H05K3/00;H05K3/38;(IPC1-7):H01L23/373 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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