APPARATUS AND METHOD FOR MANUFACTURING WAFER BUMPING TEMPLATE USING LASER

摘要

PURPOSE: An apparatus and a method for manufacturing a wafer bumping template using laser are provided to freely process the cavity shape with the high selection ratio to the template material. CONSTITUTION: A laser generator(11) generates the laser beam controlled by a controller(17). The controller controls the energy density of the laser beam generated from the laser generator. An optical system(12) faces the laser beam generated from the beam generator toward a template material(20) using a reflective mirror(13) and a lens(14). The laser beam is masked into the certain shape by the mask(15).