| 摘要 |
PURPOSE: A heat sink is provided to directly deliver the heat of the power device in the heat sink through the thermal conduction part. CONSTITUTION: The one side of the heat sink(1) is installed to be contacted with the circuit board(2). The opposite face of the heat sink is formed with lots of the heat exchange fin(1b) for which increases the heat-exchange area with air. The heat transfer member(1a) is protruded to one side of the heat sink into one body. The penetration holes(2b) are prepared in the circuit board. The heat transfer member is formed in the power device(3) into one body. The solder layer(4) is formed between one side and circuit board of the heat sink.
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