发明名称 |
SEMI-CONDUCTOR CHIP AND METHOD FOR PRODUCING A SEMI-CONDUCTOR CHIP |
摘要 |
The invention relates to a semi-conductor chip (1) comprising a semi-conductor body provided with a semi-conductor layer sequence (10) having an active area (12) and a p-conducting semi-conductor layer (11). Said active area (12) is based, preferably, on a semi-conducting compound and is also provided, preferably for producing radiation. A non-metallic connecting area (2) is arranged on one side of the p-conducting semi-conductor layer (11) that faces away from the active area (12), said non-metallic connecting area being connected in an electrically conductive manner to the p-conducting semi-conductive layer (11). Said non-metallic connecting area (2) is permeable to hydrogen. The invention also relates to a method for producing a semi-conductor chip. |
申请公布号 |
EP2111650(A1) |
申请公布日期 |
2009.10.28 |
申请号 |
EP20080706791 |
申请日期 |
2008.01.23 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
EICHLER, CHRISTOPH;STRAUSS, UWE;AVRAMESCU, ADRIAN STEFAN |
分类号 |
H01L33/00;H01L33/02;H01L33/20;H01L33/32;H01L33/36 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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