发明名称 SEMI-CONDUCTOR CHIP AND METHOD FOR PRODUCING A SEMI-CONDUCTOR CHIP
摘要 The invention relates to a semi-conductor chip (1) comprising a semi-conductor body provided with a semi-conductor layer sequence (10) having an active area (12) and a p-conducting semi-conductor layer (11). Said active area (12) is based, preferably, on a semi-conducting compound and is also provided, preferably for producing radiation. A non-metallic connecting area (2) is arranged on one side of the p-conducting semi-conductor layer (11) that faces away from the active area (12), said non-metallic connecting area being connected in an electrically conductive manner to the p-conducting semi-conductive layer (11). Said non-metallic connecting area (2) is permeable to hydrogen. The invention also relates to a method for producing a semi-conductor chip.
申请公布号 EP2111650(A1) 申请公布日期 2009.10.28
申请号 EP20080706791 申请日期 2008.01.23
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 EICHLER, CHRISTOPH;STRAUSS, UWE;AVRAMESCU, ADRIAN STEFAN
分类号 H01L33/00;H01L33/02;H01L33/20;H01L33/32;H01L33/36 主分类号 H01L33/00
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